UF4007 1000V 1A DIODE DIP.
FEATURES
- Glass passivity chip junction.
- Ultrafast reverse recovery time.
- Low forward voltage drop.
- Low switching losses, high efficiency.
- High forward surge capability.
- Solder dip 275 °C max. 10 s, per JESD 22-B106.
- Material categorization: for definitions of compliance.
- Solder dip 275 °C max. 10 s, per JESD 22-B106.
- Material categorization: for definitions of compliance.
Zain Abbas (verified owner) –
The product was exactly what I needed
Zain Abbas –
Mushtaf Ahmad (verified owner) –
Quick delivery, no hassles
Mushtaf Ahmad –
Usman Ali (verified owner) –
Fantastic prices and quick shipping
Usman Ali –
Junaid Jamshed (verified owner) –
Very satisfied with my purchase
Junaid Jamshed –
Zubair Ahmed (verified owner) –
Perfect fit and fast delivery
Zubair Ahmed –
Farhan Saeed (verified owner) –
Quick delivery and great products
Farhan Saeed –
Muhammad Arif (verified owner) –
Happy with the entire process
Muhammad Arif –